Work

The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3492672

Authors: Ming Kong, Yung-Cheng Lee, Christopher Oshman

Institutions: Xi’an Jiaotong-Liverpool University, University of Colorado Boulder, University of North Florida

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: University of Colorado Boulder

OpenAlex ID: W4404101348

FWCI:

Cites: 21

Cited by:

Related to: 10