Work

Co-Designed Silicon Photonics Chip I/O for Energy-Efficient Petascale Connectivity

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3492189

Authors: Yuyang Wang, Songli Wang, Robert Parsons, Swarnava Sanyal, Vignesh Gopal, Asher Novick, Anthony Rizzo, Michal Lipson, Alexander L. Gaeta, Keren Bergman

Institution: Columbia University

Language: English

Topic: Photonic and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Semiconductor Research Corporation, Defense Advanced Research Projects Agency

Awards: G156587711, G169953229, G478786926

OpenAlex ID: W4404101411

FWCI: 1.747

Cites: 63

Cited by: 17

Related to: 10