Work

Three-Dimensional Electro-Thermal Coupling Temperature Evaluation Modeling of Wire-Bonded Power Chips Under Surge Conditions

Year: 2024

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2024.3492917

Authors: Feilin Zheng, Binqi Liang, Xiang Cui, Xuebao Li, Lei Qi

Institutions: North China Electric Power University, State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G8853640814

OpenAlex ID: W4404101533

FWCI: 0.72

Cites: 22

Cited by: 7

Related to: 10