Work

SPICE based SI-PI co-simulation Framework to optimize Die-Package-PCB to meet LPDDR5(x) Performance in Automotive and Edge MPU-MCU

Year: 2024

Type: conference-paper

Source: International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

DOI: 10.1109/emccompo61192.2024.10742023

Authors: Rohit Halba, Pawan Kumar Gupta

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404101736

FWCI:

Cites: 5

Cited by:

Related to: 10