Impact of Thermal Interface Materials on the Device Thermal Coupling in Semiconductor Power Modules
Year: 2024
Type: article
Authors: Xiang Li, Guiqin Chang, Matthew Packwood, Qiang Xiao, Haihui Luo, Guoyou Liu
Institutions: Dynex Semiconductor (United Kingdom), CRRC (China)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4404125324