Work

Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimization

Year: 2024

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-06-2024-0026

Authors: Fang Liu, Zhongwei Duan, Runze Gong, Jiacheng Zhou, Zhi Wu, Nu Yan

Institutions: Wuhan University, Wuhan Textile University, Liaoning Technical University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404159587

FWCI: 0.312

Cites: 26

Cited by: 3

Related to: 10