An active ester‐cured resveratrol‐based epoxy film with excellent thermal and dielectric performances for high‐frequency applications
Year: 2024
Type: article
DOI: 10.1002/app.56467
Authors: Xiang Wang, Zhixi Zhao, Jizhen Tian, Huawei Zou, Pengbo Liu
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4404160044
