Work

Research on detection algorithm of solder joint wetting defect of CQFP package devices

Year: 2024

Type: conference-abstract

Source: International Conference on Advanced Algorithms and Neural Networks (AANN)

DOI: 10.1117/12.3049827

Authors: Xiangyu Sun, Xianghua Ma

Institution: Shanghai Institute of Technology

Language: English

Topic: Industrial Vision Systems and Defect Detection

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4404183528

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