Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
Year: 2024
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4067137
Authors: Mohammad A. Gharaibeh, James M. Pitarresi
Institutions: Hashemite University, Binghamton University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4404301690