Fatigue Propagation Analysis of Crack Failure in High-Power IGBT Solder Based on Multiphysics Coupling Model and XFEM
Year: 2024
Type: article
Source: IEEE Transactions on Magnetics
Institution: Hubei University of Arts and Science
Language: English
Subfield: Mechanics of Materials
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4404316997
