Analyzing Multilayer Graphene Nanoribbon‐Based Via‐Interconnect Scheme: Prospects and Challenges for Monolithic 3D Integrated Circuits
Year: 2024
Type: article
Source: physica status solidi (a)
Institution: Thapar Institute of Engineering & Technology
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4404327013