Work

Approaches to nanosolder reflow at the nanoscale

Year: 2024

Type: article

Source: Science and Technology of Welding & Joining

DOI: 10.1177/13621718241297476

Authors: Xuan Zhang, Wei Zhang

Institutions: China University of Mining and Technology, Nanjing University of Aeronautics and Astronautics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, China Postdoctoral Science Foundation, Natural Science Foundation of Jiangsu Province

Awards: G1483814461, G1621738469, G2362519623, G8005412414

OpenAlex ID: W4404361603

FWCI:

Cites: 44

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Related to: 10