Co2+-enhanced zinc aluminate microwave dielectric ceramics for electronic packaging to thermally match printed circuit boards
Year: 2024
Type: article
Abstract: With the rapid development of electronic integration technology, highly integrated chips are in urgent need of packaging materials that are thermally matched to printed circuit boards. Here, [Formula: see text]Co x Al 2 O 4 (ZCAO, x= 0.00–0.20) ceramics are synthesized using the solid-state reaction method. The phase composition, microstructure, microwave dielectric properties and CTE of [Formula: see text] in the ZnAl 2 O 4 ceramic substituted by [Formula: see text] are systematically revealed. An appropriate amount of [Formula: see text] substitution promotes a more homogeneous grain growth to form a dense microstructure. The average grain size, bulk density and relative density of ZCAO ([Formula: see text]) ceramic are 1.59[Formula: see text][Formula: see text]m, 4.472[Formula: see text]g/cm 3 and 97.4%, respectively. The optimal microwave dielectric properties ([Formula: see text], [Formula: see text],701[Formula: see text]GHz, [Formula: see text][Formula: see text]ppm/ ∘ C) of the ZCAO ([Formula: see text]) ceramic sintered at 1450 ∘ C are achieved. More importantly, the ZCAO (x = 0.10) possesses a CTE = 11.59[Formula: see text]ppm/ ∘ C that is nearly thermally matched to the printed circuit boards (PCB, CTE PCB = 12[Formula: see text]ppm/ ∘ C). This ceramic has great potential for application in the electronic packaging of PCB devices.
Source: Journal of Advanced Dielectrics
Authors: Liyuan Huang, Yuanxun Li, Yanfeng Shang, Chuming Li, Xinyan Liu, Longyuan Zhao, Fuyu Li
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4404394750