Work

Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3501478

Authors: Augusto Rodrigues, Julien Magnien, Roland Brunner, Ali Roshanghias

Institutions: Silicon Austria Labs (Austria), Materials Center Leoben (Austria)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Steirische Wirtschaftsförderungsgesellschaft

OpenAlex ID: W4404479812

FWCI: 0.616

Cites: 29

Cited by: 6

Related to: 10