Work

Assessing Copper High Density-TSVs for Reliable Performance in Cryogenic Systems

Year: 2024

Type: article

Source: IEEE Electron Device Letters

DOI: 10.1109/led.2024.3500780

Authors: Stéphane Moreau, Candice Thomas, David Bouchu

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Laboratoire d'Électronique des Technologies de l'Information, Université Grenoble Alpes

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Agence Nationale de la Recherche

Award: NANOELEC

OpenAlex ID: W4404479862

FWCI: 0.312

Cites: 12

Cited by: 3

Related to: 10