Work

Reliable Simulation Analysis of Interface and SiON Degradation Effects on Water Vapor Barrier in Laminated Thin‐Film Encapsulation

Year: 2024

Type: article

Source: physica status solidi (a)

DOI: 10.1002/pssa.202400577

Authors: Xianwen Liu, Tao Sun, Xuyang Li, Bin Liu, Qi Yao, Shuo Zhang, Zongchi Bao, Feng Wang, Tao Wang, Rui Hong, Anyuan Qiu, Zhinong Yu

Institutions: Beijing Institute of Technology, BOE Technology Group (China), Xi'an Technological University, University of Science and Technology Beijing

Language: English

Topic: Organic Light-Emitting Diodes Research

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4404513050

FWCI: 0.103

Cites: 16

Cited by: 1

Related to: 10