A polyamide-facilitated soldering approach for Mini LED precise alignment leveraging 3D interfacial networks
Year: 2024
Type: article
Abstract: Driven by the need for improved quality, energy efficiency, and visual innovation, display technology has evolved from CRT to Mini LED. However, the transfer process in Mini LED assembly poses challenges in precision. This study addressed the displacement issue during the transfer process by investigating the synergistic effects of solder and functional organic chemicals. Through the Mini LED assembly process, with the Mini LED size measuring 150 μm (length) ∗ 100 μm (width) ∗ 70 μm (thickness), polyamide was identified as a facilitator for precise alignment, which enhanced self-alignment capabilities by 68.8 % and improved the accuracy on self-aligned distance from 12.5 μm to 21.1 μm in Mini LED packaging. Through the powder coalescence approach, further extensive analysis using XPS, SEM, FTIR, and DSC reveals the synergistic effects. It supports the proposed three-dimensional polyamide-tin ion coordination interfacial network construction mechanism that facilitates solder-to-solder self-alignment and coalescence. This study provides insight into such a polymer-metal ion 3D coordination network for Mini LED precise alignment, which is promising for mass production.
Authors: Liangzheng Ji, Jing Zhang, Guoqi Zhang, Pan Liu
Institutions: Fudan University, Delft University of Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $1,300
OpenAlex ID: W4404515119