Covalent carbon woven-mesh greatly improve thermal conductivity of polyimide film at low content for battery thermal warning display
Year: 2024
Type: article
Abstract: Highly thermal conductive polyimide (PI) composites have shown great potential in electronic equipment and thermal management. However, a high content of heat-conducting fillers is frequently needed, leading to the increased costs and decreased mechanical performance that greatly limit the applications. Herein, we design a carbon woven-mesh nano-template by covalent linkage as filler and obtain in-situ polymerized PI composite films at a low loading content of 1wt%-7wt%. Surprisingly, the specific PI composite films showed significantly improved thermal conductivity with a largest increase of 730% and good mechanical performance for future utilization. The enormous improvement of thermal conductivity is attributed to the efficiently interconnected heat-conducting framework via “covalent bridge”. Moreover, the excellent thermal management capability and cycling stability of the fabricated films was proved by thermal warning display device in Li-ion battery heat managemen tapplication.
Source: Surfaces and Interfaces
Authors: Hanjiang Li, Zhewen Zhang, Xiaofeng Zhang, Wen Luo, Xueshen Peng, Xinrui Zheng, Jin Huang, Wei Feng
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $2,360
OpenAlex ID: W4404539854
