Multiphysics Simulation of Chiplet Integration Process-Induced Stress Effects on AC and DC Quantum Transport of FinFET From System Technology Co-Optimization Perspective
Year: 2024
Type: article
Authors: Liang Tian, Yizhang Liu, Wenchao Chen
Institution: Zhejiang University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G172023877, G3388651751, G7744974396
OpenAlex ID: W4404563816