Work

Thermal Shock Temperature Lifetime Modeling of Large Area Sintered Silver Baseplate Modules

Year: 2024

Type: conference-paper

DOI: 10.1109/ecceeurope62508.2024.10752056

Authors: Benjamin Fabian, Sri Sai Chandra Abhinay Nallam, Stefan Gunst, Sebastian Fritzsche, Ulla Hauf, André Schwoebel, Dennis Reiniger

Institution: Heraeus (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404564026

FWCI:

Cites: 1

Cited by:

Related to: 10