Work

Investigation of High Current Fine Grain Power Delivery for 3-D Heterogeneous Integration

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3503599

Authors: Sourish S. Sinha, Pouria Zaghari, Jong Eun Ryu, Bill Batchelor, Raymond A. Fillion, Douglas C. Hopkins

Institutions: North Carolina State University, Na Kama Kai, Asanuma Corporation (Japan), Sanwa Shurui Co., Ltd. (Japan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

Funder: Defense Advanced Research Projects Agency

Award: G4902201830

OpenAlex ID: W4404576978

FWCI: 0.718

Cites: 32

Cited by: 7

Related to: 10