Work

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits

Year: 2024

Type: article

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

DOI: 10.1109/tcad.2024.3504361

Authors: Pruek Vanna-Iampikul, Seungmin Woo, Serhat Erdogan, Lingjun Zhu, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Madhavan Swaminathan, Sung Kyu Lim

Institutions: Burapha University, Georgia Institute of Technology, Meta (United States), Pennsylvania State University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Semiconductor Research Corporation, Meta

Award: G2099603480

OpenAlex ID: W4404577055

FWCI: 1.665

Cites: 18

Cited by: 16

Related to: 10