Work

Cascading of 2D and 3D Simulations of ASIC Substrate Interconnect up to 100 GHz

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10754397

Authors: Zhekun Peng, Junyong Park, Sathvika Bandi, Santosh Pappu, Srinivas Venkataraman, Xu Wang, Granthana Ranzaswamy, DongHyun Kim

Institutions: Missouri University of Science and Technology, Meta (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404577345

FWCI: 0.802

Cites:

Cited by: 1

Related to: 10