Work

Limit of the Impact of the via Stub Length on the via Impedance in Printed Circuit Boards

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10754337

Authors: Katharina Scharff, Xiaomin Duan, Dierk Kaller

Institution: IBM (Germany)

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4404577372

FWCI: 0.806

Cites: 4

Cited by: 1

Related to: 10