Work

Design and Analysis of High-Density Silicon Interposer Channel and Power Distribution Network

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10753865

Authors: Haeyeon Kim, Joonsang Park, Hyunah Park, Keeyoung Son, Hyunsik Kim, Taeil Bae, Haekang Jung, Joungho Kim

Institutions: Korea Advanced Institute of Science and Technology, SK Hynix (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404577401

FWCI: 0.781

Cites: 3

Cited by: 1

Related to: 10