Work

Design and Analysis of Ultra High Bandwidth (UHB) Interconnection-based GPU-Ring for the AI Superchip Module

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10754190

Authors: Jungmin Ahn, Seonguk Choi, Taein Shin, Junghyun Lee, Jiwon Yoon, Keunwoo Kim, Keeyoung Son, Haeseok Suh, Taesoo Kim, Hyunah Park, Hyunjun An, Jinwook Song, Joungho Kim

Institutions: Korea Advanced Institute of Science and Technology, Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: Interconnection Networks and Systems

Subfield: Computer Networks and Communications

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Samsung

Award: G3934143559

OpenAlex ID: W4404577402

FWCI: 0.923

Cites:

Cited by: 2

Related to: 10