Work

Signal Integrity of Die-to-Die Interface with Advanced Packages for Co-Packaged Optics

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10753887

Authors: Jongchul Shin, Hamid Eslampour, Sangnam Jeong, Woopoung Kim, Seokbeom Yong, Sung-Oh Ahn, Eunkyeong Park, Sangsub Song

Institutions: Samsung Semiconductor (United States), Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404577410

FWCI: 7.007

Cites: 3

Cited by: 9

Related to: 10