Work

Efficient Thermal Analysis for Heat Dissipation in Three-Dimensional Chip-Stacking Packaging

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10753706

Authors: Cheng-Yuan Lu, Chien-Min Lin, Ruey-Beei Wu

Institution: National Taiwan University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4404577415

FWCI: 0.806

Cites:

Cited by: 1

Related to: 10