Work

Fan-Out Region Crosstalk Optimization of High-Density PCIe 6.0 SMT Connectors

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10754021

Authors: Dan Liu, Yangfan Zhong, Minzheng Tian, Mengmeng Guo, Bing Wei, Weizhe Li, Jingbo Li, Tina Bao

Institutions: Alibaba Group (China), Intel (United States)

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404577430

FWCI:

Cites: 1

Cited by:

Related to: 10