Work

Yield-Aware Interposer Design for UCIe Interconnects

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10753661

Authors: Ram Krishna, Ashita Victor, Srujan Penta, Xu Chen, Muhannad S. Bakir, Nam Sung Kim, Elyse Rosenbaum

Institutions: University of Illinois Urbana-Champaign, Georgia Institute of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Science Foundation

Award: NNCI: Southeastern Nanotechnology Infrastructure Corridor (SENIC)

OpenAlex ID: W4404577435

FWCI: 1.562

Cites: 6

Cited by: 2

Related to: 10