Work

Multiphysics-Informed ML-Assisted Chiplet Floorplanning for Heterogeneous Integration

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10753698

Authors: Vinicius C. Do Nascimento, Seunghyun Hwang, Michael J. Smith, Qiang Qiu, Cheng-Kok Koh, Ganesh Subbarayan, Dan Jiao

Institution: Purdue University West Lafayette

Language: English

Topic: VLSI and FPGA Design Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404577466

FWCI: 0.781

Cites:

Cited by: 1

Related to: 10