Work

Single-Layer Wiring Design in UCIe to Realize Low-Cost Interposer Substrate

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10754582

Authors: Soshi Shimomura, Yutaka Uematsu, Katsuya Kikuchi, Haruo Shimamoto, Yuuki Araga, Shinichi Ouchi

Institution: National Institute of Advanced Industrial Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: New Energy and Industrial Technology Development Organization

Award: G3098776136

OpenAlex ID: W4404577486

FWCI: 1.612

Cites: 2

Cited by: 2

Related to: 10