Work

Analysis of Echo and Crosstalk Cancellation in Simultaneous Bidirectional Transceivers for Dense Die-to-Die Interconnects

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10753910

Authors: Tong Liu, Taeyang Sim, Samuel Palermo

Institution: Texas A&M University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404577487

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