Work

Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling

Year: 2024

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-07-2024-0041

Authors: Xu Long, Xianyi Zhao, Kainan Chong, Yutai Su, Kim S. Siow, Zhi Wang, Fengrui Jia, Xin Wan

Institutions: Northwestern Polytechnical University, National University of Malaysia, Guizhou University, Tsinghua University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4404578298

FWCI: 0.514

Cites: 38

Cited by: 5

Related to: 10