Thermal and self‐curing kinetics of single pack epoxy adhesive with zeolitic imidazolate framework‐8
Year: 2024
Type: article
DOI: 10.1002/app.56432
Authors: Xuetang Shi, Caimian Zhang, Wenji Zheng, Lianpeng Tong, Sijia Luo, Gaohong He
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4404602248