Work

Recent Advances in Signal Integrity Simulation and Analysis of Interposers

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10754007

Authors: Jonatan Aronsson, Feng Ling

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404609326

FWCI: 0.78

Cites: 6

Cited by: 1

Related to: 10