Work

High-speed Interconnect Design of Silicon Interposer based Heterogeneous Integration for AI Computing

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epeps61853.2024.10754352

Authors: Keeyoung Son, Seonguk Choi, Keunwoo Kim, Jiwon Yoon, Junghyun Lee, Haeseok Suh, Hyunjun An, Joungho Kim

Institution: Korea Advanced Institute of Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4404609420

FWCI: 5.642

Cites:

Cited by: 7

Related to: 10