Work

Soft Elastic, Thermally Conductive, Electrically Insulating h‐BN@EGaIn/Ecoflex Composites as Encapsulation and Thermal Interface Materials Applicated in Wearable Electronics

Year: 2024

Type: article

Source: Advanced Materials Technologies

DOI: 10.1002/admt.202401365

Authors: Qi‐Qi Fu, Zijian An, Ailing Dong, Shenglin Zhang, Weixin Zhou, Ruoning Chu, Yizhou Qi, Jun Ai, Qingjun Liu

Institutions: China Jiliang University, Zhejiang University, Tsinghua University

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, China Postdoctoral Science Foundation, Natural Science Foundation of Zhejiang Province

Awards: G2172322152, G2789981952, G8785726881

OpenAlex ID: W4404618976

FWCI: 1.514

Cites: 42

Cited by: 16

Related to: 10