Balanced truncation model reduction for laser heating wafer model in frequency restricted domain
Year: 2024
Type: article
Abstract: Modeling and simulating laser heating phenomena are crucial for optimizing manufacturing processes and ensuring high-quality final products. A major challenge in semiconductor manufacturing is achieving accurate, real-time temperature control during wafer heating. To reduce the computational burden of complex mathematical models, low-dimensional reduced models can be employed. In this paper, we develop a mathematical model for laser heating in silicon wafers. For model reduction, we use the balanced truncation method, considering both frequency-unrestricted and restricted cases. Additionally, the rational Krylov subspace method is applied to solve high-dimensional sparse matrix equations. To gain key physical insights, we use the COMSOL Multiphysics package. Finally, some numerical experiments are conducted using MATLAB to validate the proposed approach.
Source: Franklin Open
Authors: Md. Saiduzzaman, Md. Shafiqul Islam, Md. Sumon Hossain, M. Monir Uddin, Mohammad Osman Gani
Language: English
Subfield: Statistical and Nonlinear Physics
Field: Physics and Astronomy
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $1,900
Award: G4232881271
OpenAlex ID: W4404667383
