Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
Year: 2024
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4067269
Authors: Pan Ren, Chulin Wang, Yaya Liang, Xuan Zhao, Xiaojie Li, Du Pingan
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G8603420406
OpenAlex ID: W4404764753