Work

Electrothermal Analysis of a Double-Side Cooling Power Module With Large-Area SiC MOSFETs

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3507913

Authors: Yi Jiang, Cancan Li, Liming Che, Yizhuo Dong, Yinjie Mao, Yongtai Lin, Guangyin Lei

Institution: Fudan University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funder: Science and Technology Program of Zhejiang Province

Award: G1333360061

OpenAlex ID: W4404788550

FWCI: 0.104

Cites: 28

Cited by: 1

Related to: 10