Heterogeneous Integration Enabled by 3-D Stitch-Chips
Year: 2024
Type: article
Authors: Shane Oh, Zhonghao Zhang, Geyu Yan, Paul K. Jo, Muhannad S. Bakir
Institution: Georgia Institute of Technology
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G110567054, G1751473256
OpenAlex ID: W4404788552