Experimental Investigation of a Compact Lid-Compatible Multijet Impingement Manifold for Direct-On-Chip Cooling
Year: 2024
Type: article
Abstract: Multi-jet impingement-based cooling manifolds, functioning as integrated networks for liquid delivery and effusion, have become increasingly important due to the rising thermal management demands of high-performance computing chips. As these chips generate significant thermal load during operation, efficient cooling solutions are essential to maintain performance and prevent thermal-related reliability issues. This study focuses on the conceptual design and assessment of an innovative manifold, with an emphasis on its thermal and hydraulic performance. A 3D-printed serpentine manifold with distributed inlets and outlets is considered, where hot and cold liquids are separated by partition walls, resulting in a compact and lid-compatible design. The manifold is designed to cool a heated area of 10 mm × 10 mm, with the heat flux reaching up to approximately 415 W/cm². To assess the performance, steady-state temperature and pressure drop across the manifold are experimentally studied under different coolant flow rates and heat fluxes. The thermo-hydrodynamic performance of the cooler is compared with existing similar designs in the literature, focusing on single-phase coolant operation. Additionally, the study extends the analysis to include two-phase operation, exploring the effectiveness of the manifold. This innovative, compact manifold design has the great potential to act as an integrated heat spreader, offering a promising cooling solution for high heat flux applications while maintaining heat transfer efficiency.
Institution: Purdue University West Lafayette
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $2,495
OpenAlex ID: W4404788591