Work

Process Mechanics Model and Asymmetric Residual Stress Analysis During 3-D NAND Manufacturing

Year: 2024

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2024.3496435

Authors: Zhiqiang Tian, Gang Zhang, Yuhua Huang, Shizhao Wang, Sheng Liu

Institutions: Wuhan University, Fuzhou University

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Basic Research Program of Jiangsu Province, National Key Research and Development Program of China

Awards: G4206979690, G5985782863

OpenAlex ID: W4404788933

FWCI: 0.513

Cites: 22

Cited by: 5

Related to: 10