Work

Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress

Year: 2024

Type: article

Source: Applied Surface Science

DOI: 10.1016/j.apsusc.2024.161911

Authors: Shanjun Ding, Xiaomeng Wu, Chuan Chen, Mengqi Gui, Peng Sun, Fang Yang, Xu Zhang, Zhidan Fang, Qidong Wang

Institutions: Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Chinese Academy of Sciences, Youth Innovation Promotion Association of the Chinese Academy of Sciences, Youth Innovation Promotion Association

Awards: G1121432813, G7954647803

OpenAlex ID: W4404801674

FWCI: 1.542

Cites: 42

Cited by: 15

Related to: 10