Work

Optimizing and Addressing Stitch Challenges in High-NA EUV Lithography for Large Die Designs

Year: 2024

Type: conference-paper

Source: International SoC Design Conference

DOI: 10.1109/isocc62682.2024.10762280

Authors: Yongchan James Ban, Gangsic Kim, Hosoon Shin

Institution: Synopsys (United States)

Language: English

Topic: VLSI and FPGA Design Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4404848056

FWCI: 1.562

Cites: 1

Cited by: 2

Related to: 10