Work

Signal Shifting-based Reusable Redundant TSV Structure for Infrastructure TSV

Year: 2024

Type: conference-paper

Source: International SoC Design Conference

DOI: 10.1109/isocc62682.2024.10762502

Authors: Donghyun Han, Sunghoon Kim, Sungho Kang

Institution: Yonsei University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Research Foundation of Korea

OpenAlex ID: W4404848073

FWCI:

Cites: 4

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Related to: 10