Work

Design of a 3D-IC based AI-Vision SoC

Year: 2024

Type: conference-paper

Source: International SoC Design Conference

DOI: 10.1109/isocc62682.2024.10762715

Authors: Sangmuk Lee, Jongseung Lee, Jeong-Ho Woo, Jinhong Park

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4404848233

FWCI: 0.803

Cites: 4

Cited by: 1

Related to: 10