Work

Wafer-level Packaging Platform for MEMS Sensor Applications

Year: 2024

Type: conference-paper

Source: International SoC Design Conference

DOI: 10.1109/isocc62682.2024.10762282

Authors: Taehyun Kim, Junmo Yang, Chungmo Yang, Sung-Hoon Choa, Hee Yeoun Kim

Institutions: National NanoFab Center, Seoul National University of Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4404848257

FWCI: 0.806

Cites: 6

Cited by: 1

Related to: 10