Work

Physics-Informed Learning Based Multiphysics Simulation for Fast Transient TSV Electromigration Analysis

Year: 2024

Type: article

Source: ACM Transactions on Design Automation of Electronic Systems

DOI: 10.1145/3706106

Authors: Xiaoman Yang, Haibao Chen, Yuhan Zhang, Tianshu Hou, Pengpeng Ren, Runsheng Wang, Zhigang Ji, Ru Huang

Institutions: Shanghai Jiao Tong University, University of Michigan, Peking University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G1449439428

OpenAlex ID: W4404859644

FWCI: 0.514

Cites: 36

Cited by: 5

Related to: 10